Hello Technetters,
Has anyone ever experienced issues with solder paste flux (or potentially flux from cored wire solder or wave solder or selective solder processes) penetrating into a chip package during reflow or cleaning or whatever? One of our customers has asked about it and I know of no incidents like this. Their question applies to all types of flux in general. But, I thought someone out there may have run across this in their travels. 

I'm trying to figure out just how that could possibly happen with all the package retooling for the higher temperature RoHS processes, but I will rely on your vast experience and knowledge to provide the right answers.

I am waiting for all the "It depends..." answers to start rolling in!

Thank you in advance,
Dale Ritzen, ASQ CQA
Quality Manager / ISO Management representative
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Austin Manufacturing Services

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