Folks,

Could you assist with any information or white papers that can help us
determine
what stresses can appear at a PBGA , and at it's solder joints, on a
1.6mm-8layer
FR4 board.

While we are attempting to keep board size as small as practible and position
of the 388 pin AMD PBGA, in consideration of several methods of mounting the
PCB we are interested in trying to predict the level of stresses that can be
tolerated so we can tailor our metal work to allow for them. Also, we have
designed to AMD's specification for Solder Mask Defined pads for this ElanSC520
PBGA and I believe this pad design is more susceptible to stress at the joints.

Regards,

Colin Weber

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