Hi Everyone,
(I apologize for any multiple emails, I was trying to use the web
interface.)
I am resurrecting this thread to add some cross section pictures.
They can be viewed here:
http://ipc-technet.groupsite.com/galleries/show/23706
The original thread is here:
http://listserv.ipc.org/scripts/wa.exe?A2=ind1205
<http://listserv.ipc.org/scripts/wa.exe?A2=ind1205&L=TECHNET&F=&S=&X=35EFD66
238A57A92B0&Y=csullivan%40mplinc.com&P=63352>
&L=TECHNET&F=&S=&X=35EFD66238A57A92B0&Y=csullivan%40mplinc.com&P=63352
And I have copied it below as well. (May 16th thread)
I agree some of the larger voids might be cause for concern, but they were
not soldered using a hot plate/pre-heater. Most of the pictures show an end
result of pre-heating the PCB on a hot plate to a top board temp of 100 °C
prior to soldering. Now my dilemma is, I have to convince the customer that
some voiding is normal and will intrinsically occur no matter what. They are
pushing back and requesting 0% voiding.
This is a 14 layer, high density, ceramic board with ½ ounce Cu throughout.
Any thoughts?
Craig Sullivan
Manufacturing Engineer
MPL Incorporated
P: 607.266.0480
F: 607.266.0482
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Subject:
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Re: Through hole barrel voids
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From:
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Craig Sullivan <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Craig Sullivan
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Wed, 16 May 2012 15:22:10 -0400
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sullivan%40mplinc.com>
Thank you for all of the answers. The connector in question is a d-sub type
and only accessible with an iron from one side. I am waiting for section
results/pictures. As one colleague pointed out, the voids seem to
concentrate on the solder side of the board. Boards are baked and removed
from the oven one at a time as they are hand soldered. These do not see a
wave/selective cycle. I am in the process of setting up the hot plate to run
a few more tests. Surface finish is ImAg and the process is SnPb. The
connector leads are pre-tinned (SnPb) so sayeth the datasheet. As for the
answers regarding the poor barrel plating I am also sectioning these, but as
I mentioned before, initial solderability was fine.
Thank you again,
Craig Sullivan
Manufacturing Engineer
MPL Incorporated
P: 607.266.0480
F: 607.266.0482
[log in to unmask]
P Please consider the environment before printing this e-mail.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Wednesday, May 16, 2012 2:28 PM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids
Let me state the obvious even though I did not see it mentioned.....it is
possible to double side hand solder and trap large voids in the barrel.....I
know because I have seen an engineer attempt this. In his mind, the solder
joints looked great and visually it was compliant.....but I advised him that
the procedure was not authorized and proceeded to xray the connection and
show him the error in his ways.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Wednesday, May 16, 2012 10:45 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids
To reject, or not to reject, that is the question:
Whether 'tis Nobler in the mind to suffer The Slings and Arrows of
unfortunate outgassing, Or to take X-rays against a Sea of voids, And by
opposing accept them: to die, to pry No more; and say we end the heart-ache,
and the thousand thermal shocks That the assembly is heir to? 'Tis a
consummation Devoutly to be wished for those who don't have a bodkin against
their chest to honor the bottom line.
Barring the chance that I have missed the connection and this was a
metaphorical response to voids or unfulfilled expectations in life and not
the printed board assembly: all other things being equal; I would accept
them (the PTH voids) as-is.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eva J
Sent: Wednesday, May 16, 2012 9:37 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids
Craig,
Was this PCB/ connector subjected to wave solder, hand solder and or
intrusive pin/paste solder process?
I have seen touch up soldering to " fill the barrel" on the component side
create voids and contaminant entrapment which may be a reliability issue.
What is the cumulative fill? Solder fill provides the mechanical strength to
withstand its service environment.
Eva
Spec Tech
On Wed, May 16, 2012 at 9:12 AM, David D. Hillman <
[log in to unmask]> wrote:
> Hi Craig! One of the downsides of now having access to Xray inspection
> technology is that we can see many "things" we never could before -
> which now causes the question "is that bad?". There is currently no
> plated thru hole void criteria in the IPC JSTD 001 specification. I
> would recommend that an assessment of the assembly be initiated.
> Pulling and inspecting a number of assemblies that either have been in
> the field or have passed all of the qualification tests will
> demonstrate what level of voids typically exist and if that level of
> voiding is a reliability issue. The presence of voids is not
necessarily an indication of a reliability issue. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
> Craig Sullivan <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 05/16/2012 07:14 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Craig
> Sullivan <[log in to unmask]>
>
>
> To
> <[log in to unmask]>
> cc
>
> Subject
> [TN] Through hole barrel voids
>
>
>
>
>
>
> Hi everyone,
>
>
>
> We have a certain board with several through hole connectors. The
> customer has provided us x ray images showing voiding in the barrels.
> Fillets on both sides are acceptable, and the solderability tests are
> ok. This seems to be isolated to this board because random sampling on
> other boards shows virtually no voiding. The only voiding "criteria" I
> can find is related to BGAs. Is there any published criteria /
> reference material for this type of defect?
>
>
>
> Thank you,
>
> Craig Sullivan
>
> Manufacturing Engineer
>
> MPL Incorporated
>
> P: 607.266.0480
>
> F: 607.266.0482
>
> <mailto:[log in to unmask]> [log in to unmask]
>
> P Please consider the environment before printing this e-mail.
>
>
>
>
>
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