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June 1999

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Subject:
Re: Reworking of PGAs
From:
No Name Available <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Jun 1999 15:55:23 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (54 lines) 
We remove PGA's quite frequently and have found the best method, without a
lot of expense, is to use a mini flow solder pot.  We put kapton tape around
surrounding areas, flux up the device, place the soldered connection in the
mini-wave and pull PGA off with a clamp that is attached to the PGA edges.
We have an experienced operator do this, and so far we've been very lucky
with lifted pads.


> -----Original Message-----
> From: Uday V. Putcha [SMTP:[log in to unmask]]
> Sent: Tuesday, June 01, 1999 1:38 PM
> To:   [log in to unmask]
> Subject:      [TN] Reworking of PGAs
>
> Hello
>
> We are in a process of developing a method for replacing and reworking Pin
> Grid Arrays (PGAs). Does anybody has any suggestion or looked into this
> problem of removing the PGAs from the board?
>
> Thanks in Advance
>
> Uday Putcha
>
>
> Uday Putcha
> Manufacturing Engineer,
> Qualcomm Incorporated.,
> Direct:(619) 651-6331
> Fax:    (619) 658-1584

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