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May 1998

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Subject:
Re: TN Electrical Conductive expoxy use of
From:
Sheila Smith <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 May 1998 09:26:21 -0400
Content-Type:
text/plain
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text/plain (43 lines) 
Paul, 

Normally you would use a self-shimming material for this type of application.  Self-shimming simply means that microballoons [i.e. tiny glass or phenolic spheres, either hollow or solid} of a minimum diameter are added to the adhesive.  When the adhesive bondline is squeezed down, the microballoons hold the two substrates apart by approximately the distance of the sphere diameter.  5 mil microballoons will give you consistent 5 mil bondlines.  You could also use a glass scrim cloth, but I doubt your customer would go for that ...

Sheila @ tracor

----------
From:  Paul Allen[SMTP:[log in to unmask]]
Sent:  Tuesday, May 19, 1998 2:29 PM
To:  [log in to unmask]
Subject:  [TN] TN Electrical  Conductive expoxy use of

Dear Tech Netters,
I have an application requiring the use of AIT electrical conductive
expoxy, ME 8452 does anyone have an experience in controlling thickness
of bond lines.Currently with our application bonding two PCB's together,
squeeze out is proving hard to control. Our customer wants zero. Any
ideas.
Paul Allan.

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