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May 2007

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Thu, 24 May 2007 13:46:11 +0200
Content-Type:
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Yes, very good report. Images not high definition model, had to shrink megs for mail.
enjoy!
Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: den 24 maj 2007 13:31
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

Yes I would like to get a copy of the report that you r Ingemar,

Yes I would like to get a copy of the report that you received from your colleague from Beijing.  It sounds like it would be interesting.

Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions Senior Principal FMA / Reliability Engineer 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell] -----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Frederick Miller
Sent: Thursday, May 24, 2007 7:55 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

Add me to the list.
Fred

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Wednesday, May 23, 2007 4:17 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder


I would like to view this presentation/report.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Wednesday, May 23, 2007 3:16 PM
To: [log in to unmask]
Subject: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

Richard, George, Werner etc chief gnus,

Want a very advanced article on the theme SAC, IMC, Phosphorous rich Ni, diffusion rate, solidifying, wetting, ENIG, crystallographic pictures, SEM pictures, etched cross sections, X-ray investigations, microprobing...more than 30 pages?

I made a consulting job (metallurgists, need assistance) and had a two hours presentation of my job. Both companies were satisfied, much thanks to advice from you, but also thanks to my collegue, who is from Beijing.
He gave me a report that lifted my eyes. I've never seen SAC/ENIG cross section presentations like that. Not even from China Lake. Can send offline if you are not too many. Please, be aware this is not a popularised kind of presentation, but at a advanced metallographic level. You may have it already...don't know, but the report is fresh.

Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
Skickat: den 23 maj 2007 20:44
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] Definition of Eutectic Solder

Hi Richard,
If you try to solder at or just above the Solidus temperature, you need a long time to get wetting [it takes thermal energy to dissolve the base metal into Sn], and you may not get good wetting art all. That is why I recommend 
Liquidus+20C for reflow soldering to Cu, and Liquidus+35C for reflow
soldering to
Ni. This time above 183 recommendation of 60 to 90 sec is wrong.



Werner



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