Amol,

We have a general guideline of the component weight must be < 0.81g/mm^2 
of soldered contect surface area. We also verify by running samples in the 
reflow oven with another part glued to the one that is soldered to the PCB. 
This to verify the surface tension can withstand 2X component weight as a 
minimum. 

Non-symmetrical parts must be verified with the 2X test above. 

Hope this helps.

Brian

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