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March 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Mar 2002 05:51:46 -0600
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Steve,

I know what you mean about no clean and the bottom side stencil aperture
cleaner on the 286 and 288 and how they used to work well with alcohol and
rma solder paste flux types.

I tried DI and plain water as a substitue with no clean some time back. With
the bottom side vacuum running, it kinda worked but must have been time
dependent. Never ran an experiment but haven't done process engineering type
stuff on stencil printers in a while either. I do miss that. Beyond that,
most folks I know just gave up on the cleaning system.

Earl

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