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November 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Nov 2008 09:32:11 -0500
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 Hi Rudolph,
You need to be aware that meeting Class 3 per 600/610 does not assure adequate reliability. That can only be assured with a Design-for Reliability as per IPC-D-279.

Werner


 


 

-----Original Message-----
From: Rudolph yu <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 18 Nov 2008 11:45 pm
Subject: [TN] IPC class 3 requirements??










Besides of meeting the class 3 solder joints crtieria per the IPC workshipment 
standards, what else will a company need to do / meet in order to claim its 
products as class 3 instead of class 2?
 
Recently one of our customers requested us to build their prodcut to the class 3 
std.  (only IPC-610, PCB can be fabricated at class2 per IPC-600)
 
Since the design only has BGA ( which share the same crtieria between class2 and 
class3), TSOP, and 0402 part, process-wise we should be able to achieve the 
tighten tolerence.  However is there other areas ( besides pure workmanship) I 
need to be aware of before we go out and claim that we can build and ship 
products as class 3?  Our company had only built to class 2 in the pass.
 
Also, how much more should we charge the customer in % now that we need to build 
the same product from class 2 to class 3?
It seems that the stencil is the only thing we will need to change for the 
purpose. 
 
Thanks
Rudolph 
 

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