Ed,
.004" is achievable with LPI but not so easy, consistently with DFSM.  I have
a question about the effectiveness of a 3 or 4 mil dam between pads.  I am
told that the purpose here is to prevent solder bridges during assembly.
Will a 3 or 4 mil dam really prevent a solder bridge?  Is the benefit
derived, if there is one, greater than the risk if you have some of these
dams lift and trap flux residue, or actually flake off during assembly?  Just
curious!
Scott

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