Do you have any information as to whether this is Omikron?

:-) -----Original Message-----
:-) From: TechNet [mailto:[log in to unmask]]On Behalf Of
:-) Hollandsworth, Ron
:-) Sent: Monday, July 31, 2000 5:14 PM
:-) To: [log in to unmask]
:-) Subject: [TN] Subj: White Tin
:-)
:-)
:-) Hello TechNet:
:-) We performed some experiments on Immersion White Tin boards
:-) and found the
:-) following . . . .  First, we had no problems with solder
:-) paste application.
:-) Second, no problems with vision systems, etc., and part
:-) placement.  Third,
:-) solder joints looked pretty good . . i.e. . no problems.
:-) Here is the
:-) kicker.  The mounting holes on the top side were white tin.
:-)  The mounting
:-) holes need to be very flat for good contact so we do not
:-) apply solder paste
:-) to these holes.  The white tin, after exposure to humidity of the
:-) environmental chambers looked very oxidized and a flaky
:-) white powdery like
:-) substance was observed.  Also under some RF type
:-) connectors, the white
:-) powdery like substance was observed.  The powdery like
:-) flaky substance did
:-) not show up under any other components only the gold RF connectors.
:-)
:-) What experience have any of you had with the immersion
:-) white tin process?
:-) Any ideas, thoughts, etc., on the powdery white
:-) substance??? We are going to
:-) have our "product assurance forensic lab" analyze it and
:-) see what they come
:-) up with, but we also thought it a good idea to tap the
:-) intelligence of the
:-) TechNet World as well.
:-)
:-) Ron Hollandsworth
:-) ITT
:-)
:-)
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