Hi,
Thank you very much for your commends. I have searched IPC-2223A, at page
13, in section "5.2.4.3. Bonded Multilayer Bending", it is written as "A
recommended bend radius greater than two bonded layers in the bend area is
20 times the overall thickness."
In our design, we also used line/space width as 4 mils. Moreover, I did not
have any experience about "bookbinding".
Is bookbinding safe? Does any standard support this method?
Can you offer any manufacturers who can do "bookbinding"?
Does bookbinding have any restrictions about line/space width?
Regards
Sefika OZKAL
_____
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, May 30, 2007 1:18 PM
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] how to bend 10-layer bonded flex
Hi Sefika,
I do not know where you get this from that "According to the IPC min. bend
radius for this type of flex is 20 x thickness = 20 x 1.02 mm=2.04 cm"-does
not make sense.
For your flex design you need a 'bookbinder' geometry.
Werner
**************************************
See what's free at http://www.aol.com <http://www.aol.com/> .
_____
From: [log in to unmask]
Sent: Wednesday, May 30, 2007 1:18 PM
To: [log in to unmask]; [log in to unmask]
Subject: [TN] how to bend 10-layer bonded flex
Hi,
I have a rigid-flex pcb which has 10-layer bonded flex. The flex part's
length is 10 cm and its width is 1.02 mm. According to the IPC min. bend
radius for this type of flex is 20 x thickness = 20 x 1.02 mm=2.04 cm. (I
know, this type of design is not recommended...) It is hard to bend the
flex. I tried to heat it at 90 C, for 45 min. Now it is better than before,
but I do not know if I did anyting wrong. I have not tested the lines if
there is open yet.
Do you think it is a good idea to heat it? And in which conditions is it
safe if so?
Or do you have any commend?
Thanks in advance,
Regards
Sefika OZKAL
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