Hello everyone!~~~~

I have a few questions concerning the "Qualification" of a new flux type
for a wave soldering process. To start out with let me state that I am
dealing with products that are Class 3 with exceptions to the standard (IPC-
610-C) with poor designs, which will not change any time soon. We are
currently using a 2% NC flux applied by spray and are changing to an RMA
18% applied via foam. The testing has shown a highly significant reduction
in the # of defects, but our customer requires certain things prior to
acceptance. So the questions are which of the following tests are truly
needed and which tests are not (and thes ones that are not needed, why?):

· SIR Testing (per IPC-TM-650) using B-36 test platform
· ECM (Electrochemical Migration) Testing
· Ion Chromatography testing each of the supplied boards
· Surface Organic Contamination
· Conformal coating adhesion
· Component compatibility
· Residue analysis as required

Now we believe that SIR and IC testing are the only ones that are truley
needed in this arena and from a practical standpoint the only necessary
ones. Now we clean these boards with a material that has proven it self
over time with a excellent inline cleaner, and have 100% confidence that
the test results from the SIR and IC will come back with stars on them.

I could really use some help here... I'm not an expert in this realm of
Engineering and would appreciate some input as ammo that could be used to
sway them to our way of thinking.

Thank You.

CAS

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