if you have prior qual sample - you might want to contact vendor to  
find out any possible deviation in process (assume you have nothing  
wrong on your side - no change of moisture content, no extension of  
shelf life, reflow oven calibrated properly, etc. etc.).  With winter  
or summer time, power outage during the lamination process can cause  
delam - even just few minutes in the press.  root cause analysis is  
cooperation between user and vendor QA and FA.  you need both to be  
honest brokers.  IMHO.  (usually you build up relationship before  
trouble start.  if you start point fingers at each other, game over.   
you might never find your "root cause").
many provide good answer for moisture content evaluation.  it is a  
lower hanging fruit you might want to start there.
good luck.
jk
On Feb 18, 2021, at 1:27 PM, Datacom - Juliano Ribeiro wrote:

> Hello to all
>
>
>
> We have problems with delamination in our PCBA and we would like to  
> test to
> discover the root cause.
>
> What are the suggestions about test to discover the root cause? The  
> goal is
> to discover if the root cause is internal or it is supplier.
>
>
>
> I saw in the IPC600 and found IPC-TM-650 2.4.28.1, does anyone know  
> this
> test and if that test finds the root cause?
>
>
>
> In particular we could send the images about problems
>
>
>
> Thank you a lot
>
>
>
> Juliano Bettim Ribeiro
>
> DATACOM
>
> Engenharia de Processos
> Rua América, 1000, Bairro Industrial, Eldorado do Sul, RS - 92990-000
> Telefone: +55 51 39333000 - Ramal 3484
>
> Telefone Celular: +55 51 98446-2135
>
> Fax: +55 51 39333003
> site:    <http://www.datacom.ind.br/> www.datacom.ind.br
> e-mail:   <mailto:[log in to unmask]>
> [log in to unmask]
>
>