TECHNET Archives

May 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Test pattern
From:
"Eltek Ltd. - Process Engineering" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 May 1998 14:48:21 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Hi technetters ,
We are trying to evaluate some alternatives for pattern plating line . Apart
of hole sizes , panel thickness etc there is great importance of pattern on
the board , that represents land areas , isolated condoctors , isolated
holes etc . Does anyone has this kind of test patern ??
Regards
Edward Szpruch
Eltek Ltd - Israel
Tel  972 3 9395050
Fax 972 3 9309581
E-mail :  [log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2