Hello people;

We have a new process to be implemented on our 600 mil DIPs w/c is  solder
dip them using 63/37 solder after component preparation (shear and splay).
Need to know more on  standard or the criteria for:

1. Solderability
2. Wetting
3. De-wetting
4. Flux residue
5. STD plating thickness and composition

Thanks. Your valuable inputs are highly appreciated.

Eric


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