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November 2003

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Nov 2003 16:29:31 +0200
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I'm not quoting any specifications but it is my personal belief that any
dewetting is a sign of faulty manufacture of the board and I would not
accept it. However, wetting balance testing may not reveal it and the
old-fashioned edge-dip test is a much more reliable one, with zero dwell
time. If the dewetted area goes right up to the non-wetted area, then
you are in real trouble. If there is a zone of good wetting between the
two AND your soldering process can reliably fit into this zone, then it
may be acceptable. That having been said, I would not like to see any
dewetting in under 10 secs.

As I say, this is a personal opinion.

Brian

Somtawin Pornpottanamas wrote:
> Do anybody know the acceptant criteria  for % dewetting on  solder
> coating on PCB board?
>
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