Hi all,

We encountered solderjoints opening (cross section show out) of PBGA component which placed on top of PCBA after passing through wave soldering, we measured the BGA ball peak temperature and it is about 170 degree C, also we notice IPC7095 define that BGA ball temperature should be under 150 degree C during wave soldering.

Now, my questions are:

1. what possible factors you think which cause PBGA solderjoint opening during wave soldering, the peak temperature of solder ball?
2. We know that IPC/JEDEC J-STD-020C defines average ramping up rate is 3 degree C/s for moisture sensitive SMD during reflow soldering, are there similar industrial standards define maximum ramping up rate for PBGA(placed on topside PCBA) during wave soldering? What the maximum ramping up rate of wave soldering is?

3. Why IPC 7095 defines BGA ball temperature should be under 150 degree C during wave soldering? To prevent solder ball remelting?

Thanks for any response!

Best regards,

Shoukai Zhang


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