TECHNET Archives

April 2005

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Ultrasonics
From:
Mark Austin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mark Austin <[log in to unmask]>
Date:
Mon, 18 Apr 2005 14:15:00 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Technetters

I seem to remember somewhere that ultrasonics shouldn't be used to clean
populated PCB's. I have believed this to be due to damage inflicted to the
wire bonds within IC's and Xtals.

Is this the case can someone clarify what components (if any) cannot be
cleaned using ultrasonics?

Cheers

Mark

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2