Hello Techies,

     Does anybody knows what is the advantage and disadvantage
of Solder paste with higher pasty range (ex liquidus: 280 solidus: 183)
over a an alloy of lower pasty range (Ex. liquidus: 312 solidus: 305).
Please list all (Reliability, wetting, etc).

     Your kind response would be of great help in my experiment.

Thanks and More power to all

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