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Subject:	Re: solderability of PTFE Taconic material boards
From:	"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 21 Sep 1999 15:19:45 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (53 lines)

Jason,
you don't say what mounting you have, screen-printed or dispensed solder, and nor the reflow method, if you have back metal and size of boards, so it's not easy to get an image of your product, however we have used Taconic, Arlon and others for two decades with some few soldering problems. We use Gold Flash over Nickel over Copper conductors, then solder print, P-P and reflow in heat conveyor ovens. I can imagine some causes for your disaster: a)too thin tin plating b)oxidized nickel under tin plating c)porous nickel plating d)wrong soldering profile. You have to sort out what step makes problem and then we will help you further, ain't easy chap. Little help when the coffee is already boiling away, but get Klein Wassink's book 'Soldering in Electronics', you will sleep with it under your pillow, I promise!

Ingemar Hernefjord
Ericsson Microwave Systems

Hello all you technetters,

Question for all the "high-freq" guys out there.
We have been building PTFE boards quite some tme and a long-running problem
has been the solderability of these boards. They are .018" thick and are
used for high frequency applications. The spec is for tin immersion plating.
No matter what reflow profiles I use, there are non-wetting signs all over
the board. The solder just won't flow properly on the pads. It looks as
though the solder flows, then stops. I've eliminated surface contamination
by washing the boards prior to build and still the same problem. Are there
any other platings available that will promote flow and won't affect high
freq reliability. Please help. Thanks.

Jason Gregory
Process Tech
Tadiran Microwave Networks
(281)263-6671
[log in to unmask]

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