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July 1998

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Subject:
Wire Bonding and Immersion White Tin
From:
Paul Wilson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Jul 1998 07:14:49 -0400
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text/plain
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text/plain (21 lines) 
TN:

Has anyone heard of any developments in wire bondability with respect to immersion white tin?

Specifically, tinned leads were viewed early on as candidates for wire bonding, but not much has been seen since that comment in a 9/23/97 IPC Proceedings publication.

Paul Wilson
Plant Chemist

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