Grant,
The old question about many " teams " inside the same company. The
project guys didn't worry about manufacturing, the manufacturing guys didn't
worry about testing and so on ... The solution is try to work as one team by
reviewing the entire process and see what really need to be changed,
sometimes the best way is change the two process at same time ( maybe one
combination of type of flux and type of test probe will solve the problem )
or change only one process. What I am trying to say is sometimes the team
has to be flexible in order to achieve a better optimized solution.
You can try send boards early to ICT guys and see the results and the ICT
guys can try different probes types either.
Thanks
Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil
> -----Original Message-----
> From: Hamilton, Richard CLE 4454 [SMTP:[log in to unmask]]
> Sent: 19 de Agosto de 1999 13:00
> To: [log in to unmask]
> Subject: Re: [TN] Solder joint curing
>
> Grant,
>
> Sounds like you have a couple of 'opportunities' here.
>
> First as an old test person, I would suggest you make sure that your ICT
> folks are using the self cleaning probes on the fixture. With a reasonable
> amount of flux these probes will survive a lot longer than an normal
> probe.
>
> Second, it sounds like you may have an excess of flux?? Or maybe it is
> just
> the way I am interpreting what you are saying. Just take a look anyway.
>
> On the subject of cleaning, well there are a couple of things to look at
> here also. You could get a cleaner and add a process or you may want to
> look
> into no-clean flux for the process you already have.
>
> In my 'life' in production here we have moved to no-clean and when we
> started SM process we started out with no-clean. We evaluated the move up
> front, and have not had any issues to deal with once making the move, so I
> can say that from our standpoint, no-clean is a big plus. AND, our ICT
> folks
> have no complaints no matter how long the board takes to get to them.
>
> Good luck, and let me know if I can be of any more help.
>
> Richard Hamilton
> Clemar Mfg. / Rain Bird
> [log in to unmask]
>
> > -----Original Message-----
> > From: Grant Emandien [SMTP:[log in to unmask]]
> > Sent: Thursday, August 19, 1999 7:18 AM
> > To: [log in to unmask]
> > Subject: [TN] Solder joint curing
> >
> > Hi all out there,
> >
> > What is the average period for a solder joint (reflow and wave) to
> 'cure'?
> > I
> > also state that I don't quite know what cure means in this instant - but
> > the
> > general problem we have is the minimum period (if there is such a
> thing!)
> > required for a solder joint to cure before introducing it to ICT under
> > reasonable conditions of stability.
> >
> > Our test guys are complaining that the assemblies reach there machines
> too
> > late (hours later), resulting in hardened flux which the test pins have
> > difficulty in penetrating, causing damaged pins, retesting and hence
> > unnecessary wear of the test fixtures and reduction in throughput.
> > Introducing the assemblies too early while the joints are still in
> > 'transition' may also result in retesting (true or false?).
> >
> > As you may have guessed, we don't clean boards as a norm however, this
> may
> > be the way to go in future as will be experimenting with a cleaner
> > shortly.
> >
> > Cheers
> > Grant
> >
>
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