I would agree with what Gregg has written, but want to stress that you do
NOT need a clean room facility to make IPC Class 3.  We do almost all class
3 work and the only cleanroom stuff is in our microelectronics assembly
rooms.  A generally clean workplace suffices for most everything.


Doug Pauls
Principal Materials and Process Engineer
Rockwell Collins

On Thu, Oct 8, 2015 at 10:05 AM, Gregg Owens <
[log in to unmask]> wrote:

> J-STD-001F Has some basic requirements in Section 4. For class 3:
>
> 4.1 ESD Mfg shall establish and implement a documented ESD control program
> per ANSI/ESD-S20.20 or otherwise specified.
> 4.2 Cleanliness and ambient environments in all works areas shall be
> maintained at levels the prevent contamination or deterioration of tools,
> materials and surfaces to be soldered or conformally coated. Eating,
> drinking, and/or use of tobacco products is prohibited in the work area.
> 4.2.1 Environmental Controls: Should (no requirement) be enclosed,
> temperature and humidity controlled, and maintained at a positive pressure
> 4.2.2. Temp and Humidity: At 30% or lower, the Mfg shall very ESD control
> is adequate. For process control, more restrictive temperature and humidity
> may be required.
>
> For cleanroom applications ISO 14644-1  Clean Room Standards is the
> current contractual standard. US FED-STD-209E was cancelled in 2001 but is
> still widely used.
>
> Gregg
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of CANTAGALLO Luigi
> Sent: Wednesday, October 07, 2015 10:58 PM
> To: [log in to unmask]
> Subject: [TN] Clean room
>
> Hello Technetters.
>
> Is there an IPC specification which gives the quality levels of workshops
> (temperature, humidity, cleanliness) according to the quality of the
> assemblies?
> For example, assemblies IPC class 3 must be necessarily assembled in clean
> rooms or just with control of humidity and temperature?
>
> Best regards,
>
> CANTAGALLO Luigi
>
> [@@ OPEN @@]
>
>
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