Hi Vlad - yes, any Sn based solder would be susceptible to gold
embrittlement since the other major element constituents don't specifically
participate in the SnAu intermetallic (IMC) reaction. The other elements
may inhibit the reaction by being a "more favored" IMC - the presence of
copper has been shown to do this. Take a look at Julie Silk's papers at
SMTAI 2013 and the paper at SMTAI 2014 in a couple weeks for additional
details.

Dave

On Fri, Sep 19, 2014 at 8:17 AM, Vladimir Igoshev <
[log in to unmask]> wrote:

> ‎I'm trying to find information on whether Sn-Bi based solders are
> susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based
> solders do.
>
> I don't see why they wouldn't but need some confirmation.
>
> As always, thank you very much in advance for constructive answers.
>
> Regards,
>
> Vladimir
>
> Sent from my BlackBerry 10 smartphone on the Rogers network.
>
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