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September 2014

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Subject:
Re: Manual Soldering - 6-UFDFN
From:
Bob Wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Wettermann <[log in to unmask]>
Date:
Thu, 4 Sep 2014 14:46:46 -0500
Content-Type:
text/plain
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text/plain (49 lines) 
Use the IPC 7711 QFN bumping process, flux paste and reflow.
http://www.solder.net/products/stencilmate-leadless-device-rework-stencils/

Contact me offline if you want more details.

Bob Wettermann/BEST


On Thu, Sep 4, 2014 at 2:06 PM, Jean-Francois Bissonnette <
[log in to unmask]> wrote:

> Hi all,
>
>
>
> We need to manually solder a DMN6070SRCL-7. Any thoughs?
>
> (package = 6-UFDFN)
>
>
>
> Thanks in advance!
>
>
>
> Jean-Francois
>
>
>
> ______________________________________________________________________
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-- 
Bob Wettermann
BEST Inc
[log in to unmask]
Cell: 847-767-5745


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