I know why this issue gets so much attention as it is important to our
shrinking SMT real estate. We all know the physics involved in solder joint
formation though don't understand it enough it seems. We all know by now if
a hole or snow removal route is available, solder will take the path of
least resistance - down the hole or best plowed path.

I/we have been using capped vias for years. Jim's article is good and points
to the ability to plate over a hole in a pad. This simply means plating over
a via, though not micro, in a way assuring electrical continuity is
effected. Otherwise, use a micro via.

No big deal but for those, especially in the R/F world, trying to get their
electron flow to follow the shortest path - down the hole of no return.
Either the engineers/designers must recalculate, punt, or plate over holes
in pads as no amount of any other effort will solve the problem. First and
foremost, don't we need solder joints for electrical performance. All the
fancy designing in the world will not get it done if solder joints aren't
the primary focus.

MoonMan

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