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June 1999

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Subject:
From:
Mike Bailey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Jun 1999 11:30:48 -0700
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I need some ammunition, please. We have a customer who is demanding 100

microinches minimum of tin/lead thickness everywhere on his SMT features

regardless of size shape and location. Solderability has not been an issue,

but perceived visual appearance is the driver. How would you respond to

this requirement, and what would you commit to? I have my own set of

numbers to throw out, but would rather here your comments.

Thanks for any information

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