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June 1999

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Paul Klasek" <[log in to unmask]>
Date:
Sun, 6 Jun 1999 15:18:43 -0700
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text/plain (74 lines)
Vishy ; before you embark on this laborious path ; consider rather uneven
wetting due to inaccurate placement,
or paste deposition (less likely) .
I'd say this is much more likely cause in your 603 instance ; you would find
different temperature only on very different tracks or pads (heat sink) on
fast profile . Slower profile could fix you up as well .
To find different temps on 603 ends, you're asking a lot ; I wouldn't ;
unless you can see a drastically wrong track design,  than you know anyhow .

See you

Paul Klasek
http://www.resmed.com

-----Original Message-----
From: Narayana Vishy-CVN002 [mailto:[log in to unmask]]
Sent: Friday, June 04, 1999 6:39 PM
To: [log in to unmask]
Subject: [TN] Thermocouple technology


One last one...

I have been working on 0603 tombstoning mostly from the pad stack/placement
point of view .

One nagging suspicion is that the solder is NOT melting at the same instant
on both the terminations . I want to analyse if the solder melting on the
two terminations of the 0603 is instantaneous or not . How can I do this ?
Are there thermocouples in the market with such resolutions which can show
this clear enough ? I am pretty new to the reflow technology stuff and would
like some recommendations on how to do this .


Regards,
Vishy

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