TECHNET Archives

December 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Eddie Rocha <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eddie Rocha <[log in to unmask]>
Date:
Wed, 28 Dec 2005 15:15:21 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (91 lines)
They are in non-thermal areas.

Thank you,
Eddie Rocha
South Bay Circuits


Are the voids near the sidewalls of the circuit features or
are they
random in the non-thermal areas central to the resin mass.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
           76 Technology Drive - POB 1890
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/>


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie
Rocha
Sent: Wednesday, December 28, 2005 3:46 PM
To: [log in to unmask]
Subject: [TN] (PCB fabrication) Lam Voids

I'm getting "LAM VOIDS" on a 16 layer board that we build.
The board is .140" thick and has 2 oz copper on layers 2,
8, 9, and 15. Any ideas on what might be causing these "LAM
VOIDS". The "lam voids" are about .004" x .010" in size and
x-sections show them between different layers such as the
surface of layers 2, 6, and 11.

I just began looking into this issue so I'll appreciate any
ideas.

Thank you,

---------------------------------------------------
Technet Mail List provided as a service by IPC using
LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with
following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send
e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send
e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional
information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using
LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with
following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send
e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at
[log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2