ACF is rather a question of cleanliness, asperity and microstructure of the two parts that are to be bonded to each other. To me, it seems egal what process to select. Take the cheapest and look out for the other matters to get a good ACF. May I ask what unusual thing you are making?
/Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: den 10 mars 2008 13:54
To: [log in to unmask]
Subject: [TN] Bonding on ENIG - correction


Inge, Wayne,

 

Thanks for the replies!

 

There is a correction I have to make and I hope you will forgive me, but I am a complete layman when it comes to bonding.

 

We are talking about ACF bonding... How will this affect the surface finishing?

 

Thank you,

 

Ioan

 

________________________________

De : Ioan Tempea
Envoyé : 7 mars 2008 08:06
À : 'TechNet E-Mail Forum'
Objet : Bonding on ENIG

 

Hi Technos,

 

A connector has to be bonded on 2 mil wide traces. Is ENIG suited as a surface finish for bonding? If yes, why, if not, why and if it depends, why?

 

Or otherwise said, I have a PCB that will get some SMT parts on both sides and then a couple hundred golden fingers will see bonding. I was presented with 2 options for the PCB finish:

a) Immersion Gold : 0.03um Au over 3um Ni over 25±10um Cu

b) ElectroBonding Gold: 0.3um Au over 3um Ni over 25±10um Cu

 

Which one is to prefer?

 

Thank you,

 

Ioan


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------