Hello,

I am looking for a tinning service to deal with an SMT part best described as
a ceramic SOJ-36.  The part has side brazed, gold plated J-leads.  The service
should have extensive experience tinning SMT devices and dealing with
coplanarity issues arising from uneven solder deposits during tinning.  Any
offers or recommendations are welcome, on-line or off-line.  Additional
details below for those interested.

Steve Mikell
SCI Systems Plant 13
(256)-882-4800 x9366
[log in to unmask]

Problems
1. The metalization of the part extends onto the bottom of the part body.  The
end of the J-lead curls to within 0.010" of the bottom of the part.  Per spec
we need to remove the gold plating from the to be soldered surface, but we
also need to not kill the what little stress relief this design offers by
soldering the lead to the part bottom.
2. Coplanarity of the lead bottoms must not exceed a range of 0.005".  A small
blob of solder on the bottom of one lead may raise other leads out of the
solder paste, resulting in solder defects.

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