TECHNET Archives

December 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"(George Milad)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 7 Dec 1999 21:47:04 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
At Shipley Ronal we beleive that this surface finish is very capable and will
give you all you need.
It is an excellent surface for solderabilty provided the Pd is below 12 uins
The soldering will occurr between the solder and the Nickel, both Pd and the
gold will disssipate into the solder joint with no adverse effects.
It is suitable for both aluminum and gold wire binding  the aluminum bonds to
the Ni and the gold would bond to the Palladium..
It is ideal for compression or press fit connectors as well contact switch
surfaces.
George Milad
Shipley Ronal

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2