An interesting view of stress testing is available as a joint paper from
Delphi, Microtek Labs, and Conductor Analysis Technology from IPC Expo 2003.  The
web address for the paper is on the Microtek web page:

http://www.thetestlab.com/data/HATS_expo_2003.pdf

As I understand, the IST test requires current in the copper foil to drive
the temperature excursions.  This testing in this article uses hot/cold air
temperature cycling and monitors circuit performance.  So, the special equipment
used in IST testing would not be required.  Both methods use dedicated artworks
for their circuit patterns.

Denny Fritz
MacDermid, Inc.

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