During PCB fabrication opens and shorts are major defects observed at ET. we conducted a DOE on a specific partnumber and found that every step change at primary imaging has a great degree of corrilation to Opens and Shorts. However the photoresist manufacturer specs are very wide 5 to 8 SST or 12 to 18 RST.Why are we finding a huge quality difference inside the specification ? How are you taking care of the above?
PLEASE COMMENT AT [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************