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April 2019

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Subject:
From:
"Stadem, Richard D" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:
Wed, 10 Apr 2019 15:20:50 +0000
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Yes, we do the same. No dinkin' around, just pre-bake and assemble. I think that is the fastest and cheapest handling method, actually.



-----Original Message-----

From: TechNet <[log in to unmask]> On Behalf Of Dave Schaefer

Sent: Wednesday, April 10, 2019 10:18 AM

To: [log in to unmask]

Subject: Re: [TN] risk of PCBA moisture uptake



All of our MSD devices are pre-baked prior to processing regardless of how they have been packaged and stored.



From experience I can tell you that these devices will identify themselves if not handled properly.


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