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Date: | Wed, 12 Oct 2005 06:40:31 -0400 |
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Ingemar,
Good afternoon to you! Hope everything is well over on that side of the globe.
Can you attempt to define what reliable plating results might be? Have you been most concerned about trace components incorporated into the plated film - such as brighteners and grain refiners, etc.
Or is it something as simple as - this guy's plating works for us [we might not know why, but it works] the majority of the time, and this guy's does not.
No doubt you heard about the sale of CTS Microelectronics. I have been getting in some aerial Fall color tours lately. Not really looking forward to shoveling the white stuff, however.
Steve - Gentex
-----Original Message-----
From: Ingemar Hernefjord (KC/EMW)
[mailto:[log in to unmask]]
Sent: Wednesday, October 12, 2005 5:18 AM
To: [log in to unmask]
Subject: Re: [TN] wire bonding
Hi Kathy,
we have been using Al wedgebonding on ENIG for many years, from 37um wires to 250um.
Works just fine.... if you have a reliable ENIG plater, of course.
Ingemar Hernefjord
Ericsson Microwave Systems
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy
Sent: den 11 oktober 2005 21:42
To: [log in to unmask]
Subject: [TN] wire bonding
Question for the assemblers:
When wirebonding to ENIG, do you use any solder paste or other "facilitator"
to create the bond?
Thanks for your reply...
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