Thank you Dave and Joyce for the references. These are exactly what I need.



☺





Best regards,

Raye Rivera

Quality Manager





From: David Hillman <[log in to unmask]>

Sent: Friday, December 13, 2019 5:47 AM

To: TechNet E-Mail Forum <[log in to unmask]>; Rivera, Raye <[log in to unmask]>

Subject: Re: [External] [TN] BGA rework reliability



Hi Raye - there have been a few papers published at the SMTAI Conference on BGA rework of the last few years.  Here are a few that showed up when I did a quick search of the SMTA Knowledge library (quite a few more too):



05/14/2013

Process Control And Reliability Of Reworked Bga Solder Joint<https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3692>

Adrian Hirceaga and Ishrat Hasan

 Creation Technologies



10/16/2011

Bga Rework Challenges Of High Thermal Mass, Large PCBA’s<https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3339>

Manivannan Sampathkumar, Gopinath Aravindakshan, Denis Jean, and Dale Lee

 Plexus Manufacturing Solutions, Plexus Manufacturing Technology Development, and Plexus Engineering Solution



04/30/2009

Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies<https://www.smta.org/knowledge/journal_detail.cfm?ARTICLE_ID=165>

Lei Nie, Michael Osterman, and Michael Pecht

 Center for Advanced Life Cycle Engineering (CALCE)



01/01/2005

HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS<https://www.smta.org/knowledge/journal_detail.cfm?ARTICLE_ID=100>

Alan Donaldson and Raiyo Aspandiar

 Intel Corporation



On Thu, Dec 12, 2019 at 6:22 PM Rivera, Raye <[log in to unmask]<mailto:[log in to unmask]>> wrote:

Hello all,



Can anyone point me to a study regarding the reliability of reworked BGAs? As in what is the impact of removing and replacing a BGA.



Thanks in advance.



Best regards,

Raye Rivera

Quality Manager