Hi folks!

I see what seems to be a contradiction in plating void criteria in the
IPC-6012 for Class 3.  Table 3-3 (Plating and Coating Voids Visual
Examination) says "none" for copper voids allowed.  Table 3-6 (Plated Hole
Integrity After Stress) says "one void allowed per specimen provided the
additional microsection criteria of 3.6.2.2 are met."  Since voids are not
created by the stress, why would they be allowed after stress (in cross
section) but not before (seen visually)?

Thanks,

Debbie

Deborah S. Schepis
Quality Engineer
Endicott Interconnect Technologies
(607) 755-3152
email: [log in to unmask]

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