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April 1998

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Subject:
From:
"Berriche, Ridha" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 3 Apr 1998 14:28:00 -0500
Content-Type:
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text/plain (23 lines)
I am looking for information or references on current carrying capacity of bond
wires (Al in particular) in mold compound for plastic packages.

I want to be able to predict the maximum current with respect to a rise in
temperature of the wire

Thanks in advance.

Regards
Ridha Berriche

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