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July 1998

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Subject:
From:
John Laur <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Jul 1998 09:08:42 -0500
Content-Type:
text/plain
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text/plain (64 lines)
Ralph,
I have some info on a screenable polymer thick film paste for pluging vias
for thermal conductivity.  I have never used the materilal.  It is from
DuPont Electronoc Materials.  Thermal conductivity is spec'd at 5.23W/m/K.
CB100 CONDUCTIVE VIA PLUG

If your interested send me your fax number.

John Laur
Rockwell Automation
Milwaukee, WI




"Vaughan, Ralph H" <[log in to unmask]> on 07/01/98 07:41:51 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Vaughan, Ralph H" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: John C Laur/Milwaukee/RA/Rockwell)
Subject:  [TN] Thermallly conductive PWB materials




Dear PWB fab guys,
Can you provide any news, good or bad, on material used in boards to
help move heat away from hot parts?  We have tried the standard methods
of leaving unused copper in the board rather than etching it away, and
using thermal pads under the parts, but my designers think they need
more thermal conduction through the pwb.  If anyone has any experience
with the thermally conductive pre-pregs, or any other similar material,
I would appreciate your thoughts.
thanks
Ralph Vaughan
Boeing-Atlanta
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