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October 2020

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Tue, 6 Oct 2020 10:12:50 -0500
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We are considering a change to a manufacturing process which will save time
and money,
but will cause extra stress on the completed board assembly.
Q1) I'm familiar with bow and twist for bare boards, but is there data on
flexing a completed assembly? I'm sure it depends on board thickness and
material, etc. but is there danger to the  board itself? or does it always
break a component first?
Q2) I'm NOT familiar with stress on components. How can I determine whether
we are in danger of damaging components, especially SMDs?

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