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July 1998

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Jul 1998 14:48:18 -0700
Content-Type:
text/plain
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text/plain (31 lines)
Technetters,
I have a question regarding soldermask web surrounding fine pitch components
pads/leads. In our current fabs, we are finding that not all 20 mil pitch
components leads had soldermask web so we have decided to provide soldermask
layer with 1:1 opening for pad, without any clearance.

I am expecting that fab house will provide some solder mask clearance to
prevent solder mask running over the pads along with soldermask web
surrounding fine pitch leads.

Please let me know if it is good idea or not with pros and cons.

re,
ken patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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