TECHNET Archives

July 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 28 Jul 2009 15:22:05 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (277 lines)
Well thank you, Inge. Likewise.
Some days I feel as smart as a rock....

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, July 28, 2009 2:29 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Master Stadem, you will get a award one day for your well-reasoned and 
incontrovertible sayings. Solid as a rock, whatever you say.

Inge

----- Original Message ----- 
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 28, 2009 8:19 PM
Subject: Re: [TN] Solder Paste test method mods


Too add something further, I think that the test methods should be using
a specific reflow profile for solder paste in conjunction with one of
the IPC or Heraeus Benchmarker II test boards, rather than the
antiquated hot plate method.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, July 28, 2009 12:58 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Yes. Some fluxes transfer heat much more readily than others. Not all
fluxes are designed to burn off prior to reflow taking place, whether as
a standalone flux or as part of solder paste.
But I agree that the amount of time is irrelevant; the complete
agglomeration (no spitting or congealing) of the deposit is what is
critical in the agglomeration test on ceramic or FR-4, and the degree of
wetting spread once the paste reaches temperatures above the melting
point is what is critical on the wetting test on bare copper. The
variation in test apparatus is too widespread to make the time it takes
part of a requirement.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, July 28, 2009 12:47 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Is time to reflow really dependent upon the flux type?  I agree with the
others - mass, geometry, and of course the alloy metallurgy.

Kevin

-----Original Message-----
From: Inge [mailto:[log in to unmask]]
Sent: Tuesday, July 28, 2009 1:29 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Paste test method mods

Graham,

I can't see the purpose of such a requirement. Time to reflow is
dependent
on the hotplate's surface condition, the contact surface geometry, used
flux
and maybe more factors. I  have never seen any useful investigations,
nor
any papers on this matter. The time to reflow on a hotplate...what is
the
need of that? Heat transfer varies from machine to machine, from process
to
process.

Inge

----- Original Message -----
From: "Graham Naisbitt" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 28, 2009 5:40 PM
Subject: [TN] Solder Paste test method mods


> Greg and fellow Techies
>
> I am in the process of submitting revisions to solder paste tests
called
> up in TM-650 and need your help.
>
> In 2.4.43 Solder Ball - 2.4.45 Wetting and 2.4.46 Spread Tests, we
need
> to allow for lead-free alloys. In each of these there is a quoted
time:
>
> "The reflow shall occur within 20 seconds after the specimen is placed
in
> contact with the hot plate."
>
> The recommendation is to include the following:
>
> "For lead-free solder pastes, the reflow time shall occur within 30
> seconds after the specimen is placed in contact with the hot plate."
>
> Does anyone out there in Techieland have any objections to this
proposed
> addition to each of these test methods?
>
> Thanks in advance
>
> Regards
>
> Graham Naisbitt
> Managing Director
>
> E: [log in to unmask]
> P: +44 12 5252 1500
> F: +44 12 5252 1112
> W: www.gen3systems.com
>
> GEN3 SYSTEMS LIMITED
> Incorporating Process Support Products
> Unit B2, Armstrong Mall
> Southwood Business Park
> FARNBOROUGH
> Hampshire GU14 0NR - UK
>
> Engineering Reliability in Electronics
>
>
> Registered Number: 4639449 (England & Wales). Registered Office as
above.
> DISCLAIMER : This message is intended only for the use of the
individual
> or entity to which it is addressed and may contain  information which
is
> privileged, confidential, proprietary, or exempt  from disclosure
under
> applicable law. If you are not the intended  recipient or the person
> responsible for delivering the message to the  intended recipient, you
are
> strictly prohibited from disclosing,  distributing, copying, or in any
way
> using this message. If you have  received this communication in error,
> please notify the sender and  destroy and delete any copies you may
have
> received. Any views or  opinions presented in this email are solely
those
> of the author and  might not represent those of Gen3 Systems Limited.
> Although Gen3  Systems Limited has taken reasonable precautions to
ensure
> no viruses  present in this email, Gen3 Systems Limited can not accept
the
> responsibility for any loss or damage arising from the use of this
email
> or attachments.
>
>
>
>
>
>
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text
in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at
[log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask]
or 
847-615-7100 ext.2815
----------------------------------------------------- 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2