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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Mon, 15 Apr 2013 16:43:11 +0000
Content-Type:
text/plain
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text/plain (262 lines)
If you dead, I am believe it is oxygen free possibly.  ;-(

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Monday, April 15, 2013 12:41 PM
To: [log in to unmask]
Subject: Re: [TN] Pakeout and PCB Separators

I guess find at least one oxygen atom? 

 Hey - I see one over there, prove me wrong?

Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ahne Oosterhof
Sent: Monday, April 15, 2013 12:27 PM
To: [log in to unmask]
Subject: Re: [TN] Pakeout and PCB Separators

The next question is: how do you verify that you are successful?

Ahne.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: 15 April, 2013 08:31
To: [log in to unmask]
Subject: Re: [TN] Pakeout and PCB Separators

Inge,

 Did you want a serious response or just a Causerie?  :-)

 If you attempt to remove all the oxygen, every single atom, then only your
success rate will hit ZERO.

Actually, now that I think about it, bare metal in a vacuum chamber might
just serve as a "Getter" like the coatings inside old vacuum tubes. So I do
wonder how effective a vacuum chamber might be in reducing oxidation at
elevated temperatures. It might help but I don't know.

Bob



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Sunday, April 14, 2013 2:43 PM
To: [log in to unmask]
Subject: Re: [TN] Pakeout and PCB Separators

Oxidation...Oxygeg.question for Bob: Remember our little discussion on
'zero' . What I ask now has no practical application. I have had the thought
before when I used ultrahigh vacuum (exp -12)..Now to question: Is it
possible to remove all oxygen molecules in a volum made of xxxxx. I mean
zero molecules, not one single molecule. Or is there a place in Universe
where a Oxygen atom is unthinkable?

Inge


On 10 April 2013 16:54, Robert Kondner <[log in to unmask]> wrote:

> I will agree about oxidation but not faster drying. I mean the vapor 
> pressure of water is already  quite low at room temperature. I think 
> drying time for a material with absorbed vapor is fixed by diffusion 
> rates and distance. And temperature is a bit driver of diffusion rate.
> Is air pressure even in the equation?
>
> Bob K.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
> Sent: Tuesday, April 09, 2013 2:12 PM
> To: [log in to unmask]
> Subject: Re: [TN] Pakeout and PCB Separators
>
> Baking in Vacuum oven = less pads oxidation and faster drying
>
>
> On Tue, Apr 9, 2013 at 9:00 PM, Glidden, Kevin
> <[log in to unmask]>wrote:
>
> > Someone in Technet not long ago posted up an excellent little write 
> > up from  Gordon Davy about water vapor and drying.  I've attached it 
> > to Phil and Bob.
> >
> > It contends vacuum ovens do nothing to increase drying rate.
> >
> > Drying is a function of temperature and delta between concentration 
> > of water in the middle versus at the surface.
> >
> > I presume, like any drying, the greater the surface area exposed the 
> > faster the drying.  I would place the PCBs (as much as possible) 
> > directly on racks or in card holders (on edge).
> >
> > -----Original Message-----
> > From: Nutting, Phil [mailto:[log in to unmask]]
> > Sent: Tuesday, April 09, 2013 1:01 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Pakeout and PCB Separators
> >
> > Robert,
> >
> > How about placing them in a vacuum chamber.  That would release all 
> > the moisture and definitely if you could add a little heat.  I would 
> > envision separating the boards with a mesh and spacer to allow the 
> > moisture to fully escape.  Placing a paper towel between layers 
> > might not let all the moisture escape.
> >
> > But then this is just my opinion.
> >
> > Phil Nutting
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
> > Sent: Tuesday, April 09, 2013 12:54 PM
> > To: [log in to unmask]
> > Subject: [TN] Pakeout and PCB Separators
> >
> > Hi,
> >
> >
> >
> > Does anyone know if separators of some type between PCBs can reduce 
> > bake out time?
> >
> >
> >
> > If I have a stack of PCBs, and I place something like paper towels 
> > between PCBs, can the bake out time be reduced? I would imagine the 
> > diffusion rates of moisture in the paper towel material would be 
> > much higher than in solid PCB laminate. But, that is just a guess.
> > Could be
> perfect hog wash.
> >
> >
> >
> > My problem is not with PCBs but with 30 mil sheets of plastic that 
> > feed a thermoforming process.  I am using PETG but I still see small 
> > bubbles in the material after forming. I tried a short bake out, and 
> > it helps, but I cannot heat very high as the 30 mil plastic sheets 
> > will easily deform. I need to lay them flat, heat gently, and still 
> > try to removed moisture. I was wondering what the best way to 
> > separate sheets and allow drying might be.
> >
> >
> >
> > Any Ideas?
> >
> >
> >
> > Thanks,
> >
> > Bob K.
> >
> >
> >
> >
> >
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>
> --
>
> Best Regards,
>
> *Reuven Rokah*
>
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