If the grinding process takes out a "good" joint, you've found the
problem!  I like the dye idea, but it still puts the pc board at
risk--and most of the problems I'm trying to solve have to do with
wetting and profile.

Wayne

>>> [log in to unmask] 6/16/2006 2:41 pm >>>
There is a process that uses dye to penetrate the weak or
fractured solder joints. After the dye has a chance to penetrate it is
washed off and the part is snapped off. Any dye left on the pad would
tell you where your fracture/bad solder joint was at, even if the bad
joint was on the BGA side, not on the board side. The problem with
going
the cutting wheel way is that it sounds like you expect the problem to
be at the center of your BGA. By the time you get there, with your
grinder, you would have an opportunity to added enough force and
vibration to cause a failure that my have otherwise not existed.

Ted

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