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Date: | Tue, 11 Apr 2006 08:47:27 -0700 |
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Leo,
Is this a via-in-hole layout? If so what is the spec's on that hole and how
it was capped or not? If not what is the board finish/board thickness, etc?
What kind of BGA and type of balls (leaded/lead-free). More details.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Lin Leo
Sent: Monday, April 10, 2006 8:19 PM
To: [log in to unmask]
Subject: [TN] ??: RE: [TN] Void issue after soldering
I am interested the void just above intermetallic compound(IMC) at SMT &
BGA.
Richard Kraszewski <[log in to unmask]> : Please provide more details.
Through-hole, surface mount, BGA, ?, etc.
________________________________
From: TechNet on behalf of Lin Leo
Sent: Sat 4/8/2006 2:20 AM
To: [log in to unmask]
Subject: [TN] Void issue after soldering
Hi,
Did anyone have literature or web site that discusses void issue after
soldering?
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