Thank you Werner, Paul,Jim and everybody!
I was very short in my first letter, not knowing if there are people who will be
interested to answer me.
The true story is, that I am dealing with the approval of a new component which I am
BUYING, not manufacturing.
It is an ISOLATOR for microwave applications, custom made.
It consists mainly of a coil , a resistor, and 3 groups of 2 piggy back ceramic
capacitors mounted on a little piece of FR4.One of the capacitors has, gold
terminations, I did not check if they are only plated or else.It sits piggy back on an
other capacitor with tin terminations. This component must withstand at least 2 thermal
excursions during reflow soldering on the main circuit.
I wanted to check the reliability of the component at least by putting it through the
reflow oven and checking it visually. After 1 excursion I saw the specific capacitor
was separated from the one underneath , a crack could be seen, and the solder on it was
dull and grainy. I am aware about the following problems during the component's
manufacturing:
-Restrictions of soldering temperature due to FR4
-Restrictions of solder composition due to gold terminations and subsequent reflow
soldering.
I would like to help to improve the manufacturer's process and get a reliable
component.
Thanks,
Gaby
Werner Engelmaier wrote:
> Hi Gaby,
> There is no such thing as a "gold termination"; you have some metallization
> that is covered with gold to protect it, most likely, from oxidation. Gold
> goes into solution in liquid tin too fast for this. So the real question is
> how to best solder to the metal comprising the layer underneath the gold. My
> advice would be to try your standard soldering procedures; they most likely
> will work.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL 32174 USA
> Phone: 904-437-8747, Fax: 904-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
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