Well I did it. I destroyed the heat sink in the name of what makes thins
work. It turns out, to get the nearly half pound heat sink to sink, it's not
just a film thermal thing. It is a thermally adhesive backed very thin
aluminum foil heat spreader about .100" over the size of the CPU.

Again, the back side is attached to the heat sink surface. The front size,
with its carbon based gunk, interfaces with the CPU and does come off with
removal. An interesting part of this is it will come off and leave exact
imprints where parts of the material is left on the CPU.

What's interesting, as I have junked the Intel MB in favor of my favorite
Asus brand MB, is the heat sink mounting orientation is 90 degrees different
than the Intel setup. Therefore, it is impossible to achieve the desired
orientation to take advantage of mating with the patterns left on the CPU.
Hence, I cannot use the heat sink again. This leaves me in an interesting
situation concerning whether I buy another processor with required heat sink
or solicit Intel for more heat sinks.

I'm thinking of buying some brass or copper shim stock and using thermally
transmissive goop to attempt simulating or improving thermal conductivity.
Might be an expensive buty very interesting experiment.

Still, I wonder, with all the conversations we've had on fourm about thermal
grease effectiveness and other materials, what is the best?

MoonMan

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