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February 2022

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Subject:
From:
Peter Wong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter Wong <[log in to unmask]>
Date:
Fri, 25 Feb 2022 22:07:29 +0000
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Does anyone know of a company that can remove a non-reworkable underfilled BGA?

I see that Air-Vac sells a high precision milling machine that can claims to be able to do this.

We have 20 boards with a 0.79 mm x 0.79 mm BGA that needs to be removed.  The closest component to this BGA is about 0.4 mm away.

Thanks
Peter
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